The present project aims at the development of new processes for the assembly and the wire bonding of electronic circuits with digital laser printing and sintering technology, in order to integrate them into industrial processes of packaging and production of electronic circuits. In particular, the first application we describe is the assembly of electronic components with contact pad sizes smaller than the minimum dimension (0.2 mm) that the state of the art surface mount technology (SMT) can achieve. The proposed digital laser technology has a resolution of 10 micrometers, and allows accuracy in controlling the amount of conductive paste at the level of 10 nL. In addition, laser printing technology will be applied for the innovative manufacturing of electrical connections for integrated circuits in BGA packaging with a resolution of 10 micrometers. For the second application, printable materials with silver and copper nanoparticles will be designed, manufactured and characterized by two project partners, until their properties are optimized for high-conductivity and high mechanical strength interconnections. The packaged integrated circuits which will be achieved by laser printing will undergo the assembly process also with laser printing in order to demonstrate fully functional electronic circuits with contact sizes smaller than the current limit of the surface mount technology. The added value of the proposed technology lies in the increase of the printing speed and resolution of electronic circuit assembly and wirebonding, which is in line with the general trend of microelectronics towards dimensions’ shrinkage. Both of the aforementioned processes will be integrated in laboratory prototypes capable of accomplishing high resolution and high speed wire bonding and assembly of electronic circuits. The proposed technological breakthrough will be a valuable innovation for the field of microelectronics and will be exploited primarily by the end-user of this project, which is active in the field of microelectronics, but also by the rest of the consortium.
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Work Packages of the Project:
WP1: Technical Specifications
WP2:Manufacturing of Inks and Adhesive pastes with Silver and Copper Oxide nanoparticles
WP3: Development of assembly and wirebonding processes by means of laser printing
WP4: Prototype for assembly and wirebonding of electric circuits with laser
WP5: Patenting
The project has been co‐financed by the European Regional Development Fund of the European Union and Greek national funds through the Operational Program Competitiveness, Entrepreneurship and Innovation, under the call RESEARCH – CREATE – INNOVATE with budget 857.679,30 € (project code:T1EDK-00814)