2021
-
Makrygianni, M.; Zacharatos, F.; Andritsos, K.; Theodorakos, I.; Reppas, D.; Oikonomidis, N.; Spandonidis, C.; Zergioti, I. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. Materials 2021, 14, 3353. (https://doi.org/10.3390/ma14123353)
-
F. Zacharatos, M. Makrygianni and I. Zergioti, "Laser-Induced Forward Transfer (LIFT) technique as an alternative for assembly and packaging of electronic components", in IEEE Journal of Selected Topics in Quantum Electronics; (doi: 10.1109/JSTQE.2021.3084443)
-
Evgenia Dimitriou and Nikolaos S. Michailidis, "Printable conductive inks used for the fabrication of electronics: An overview", Nanotechnology 2021, Accepted Manuscript. (http://iopscience.iop.org/article/10.1088/1361-6528/abefff)
-
Marina Makrygianni, Ioannis Theodorakos, Filimon Zacharatos, Dimitris Reppas, Panagiotis Papadopoulos, Nikolaos Oikonomidis, Christos Spandonidis, Ioanna Zergioti, "Laser induced forward transfer of solder paste for microelectronics assembly applications," Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730X (10 March 2021); (https://doi.org/10.1117/12.2577693)
2020
-
M. Makrygianni, E. Margariti, K. Andritsos, D. Reppas, F. Zacharatos, N. Oikonomidis, Ch. Spandonidis, I. Zergioti, "High Speed Soldering Using Laser Printing for the Assembly of Electronic Components", JLMN-Journal of Laser Micro/Nanoengineering, (2020) , Vol. 15, No. 3. (link)